| 摘要 |
PURPOSE: A structure for preventing damage to a semiconductor chip is provided to improve yield and reliability, by forming a damage preventing pattern in an interface between the semiconductor chip and a sawing region. CONSTITUTION: A semiconductor chip(100A,100B) having a bonding pad is formed in a semiconductor substrate(110). A nitride layer(120) is located on the semiconductor chip having the bonding pad, isolating the semiconductor substrate from a passivation layer(130) and protecting the semiconductor substrate from external damage. The passivation layer and the nitride layer are eliminated to form a damage preventing pattern of a narrow groove type, wherein the damage preventing pattern surrounds the semiconductor chip and is located in an interface between the semiconductor chip and a sawing region.
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