| 摘要 |
PROBLEM TO BE SOLVED: To perform uniform polishing and high-speed and high-pressure polishing and to improve using efficiency of slurry. SOLUTION: In this polishing pad 1 having a pad body 2 for pressing and rotationally polishing a semiconductor wafer W, many recessed grooves 4a to 4c in which slurry flows are formed on the pad body 2 so as to intersect to one another, many projecting parts 5a to 5c aligned longitudinally and laterally on the flat surface and having plane regular hexagonal shapes are provided, and one projecting part out of the projecting parts 5a to 5c is arranged in the longitudinal positions of respective recessed grooves 4a to 4c. |
