发明名称 LOW STRESS INTERFACE BETWEEN MATERIALS DIFFERENT IN COEFFICIENTS OF THERMAL EXPANSION, AND METHOD OF MANUFACTURING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a low stress interface formed between two materials having coefficients of thermal expansion different from each other. SOLUTION: This low stress interface has a laminated structure 101 including a first layer 104a made of a first material, a second layer 104b made of a material different from that used in the first layer 104a, and further having a layer 107 formed between the first and second layers and made of a third material 107, the laminated structure 101 has a substantially flat surface 121, and has a coefficient of thermal expansion (TCE) in a certain lateral direction, and a second material 106a is bonded to the laminated structure 101 to form an interface 118, and the second material 106a has a substantially flat surface 122 and has a coefficient of thermal expansion (TCE) same as that of the laminated structure 101.
申请公布号 JP2001150399(A) 申请公布日期 2001.06.05
申请号 JP20000305635 申请日期 2000.10.05
申请人 AGILENT TECHNOL INC 发明人 BARTH PHILLIP W
分类号 G02B26/08;B32B7/02;B81B3/00;B81C3/00;G02B6/12;G02B6/35;G02B26/02;(IPC1-7):B81C3/00 主分类号 G02B26/08
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