发明名称 Method of manufacturing mixed mode semiconductor device
摘要 A method of manufacturing the metallic electrodes of a capacitor in a mixed mode semiconductor device. The method comprises the steps of providing a substrate having a conductive layer and the lower electrode of a capacitor formed thereon, and then depositing a dielectric layer over the substrate. A first opening and a second opening are then formed in the dielectric layer. The first opening exposes a portion of the conductive layer while the second opening exposes a portion of the lower electrode. Finally, a conductive plug and the upper electrode of the capacitor are formed in the respective first and second openings that are in corresponding positions above the conductive layer and lower electrode, respectively.
申请公布号 US6242315(B1) 申请公布日期 2001.06.05
申请号 US19980186126 申请日期 1998.11.04
申请人 UNITED MICROELECTRONICS CORP. 发明人 LIN CHEN-BIN;CHUNG CHENG-HUI;LIN YEI-HSIUNG;HUANG CHING-CHUN
分类号 H01L21/02;H01L21/768;(IPC1-7):H01L21/20 主分类号 H01L21/02
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