发明名称
摘要 PROBLEM TO BE SOLVED: To enhance a semiconductor device in manufacturing yield and reliability, by a method wherein a capacitor is set uniform in capacitance, and a gate insulating film is enhanced in uniformity of film quality. SOLUTION: A base semiconductor is oxidized through an upper electrode after the electrode is formed, whereby a capacitor electrode is simplified in manufacturing process. That is, a high-melting metal 14 is deposited on a semiconductor layer 13, oxidizing agent is diffused through the high-melting metal, and only the base semiconductor layer is selectively oxidized at an interface, whereby a thin semiconductor oxide film 15 is formed between the high-melting metal 14 and the semiconductor layer 13. By this method, a capacitor comprised in a semiconductor device or the gate insulating film of a MOSFET can be formed.
申请公布号 JP3172081(B2) 申请公布日期 2001.06.04
申请号 JP19960060954 申请日期 1996.03.18
申请人 发明人
分类号 H01L21/8247;H01L21/316;H01L21/822;H01L21/8242;H01L27/04;H01L27/108;H01L29/788;H01L29/792 主分类号 H01L21/8247
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