发明名称 Printed circuit board and method of manufacturing the same
摘要 A printed circuit board includes an uncured substrate material with closed voids which are disposed with a through-hole. When the through-hole is formed, voids which exist in the substrate material open from inner wall of the through-hole to form a hollow-shaped part. By filling the through-hole and the hollow-shaped part with conductive paste, the adhesion improves by the increased holding effect between the conductive paste and the wall surface of the through-hole.
申请公布号 US2001002294(A1) 申请公布日期 2001.05.31
申请号 US20000741001 申请日期 2000.12.21
申请人 HATAKEYAMA AKIHITO;NAKATANI SEIICHI;KAWAKITA KOUJI;SOGOU HIROSHI;OGAWA TATSUO;KOJIMA TAMAO 发明人 HATAKEYAMA AKIHITO;NAKATANI SEIICHI;KAWAKITA KOUJI;SOGOU HIROSHI;OGAWA TATSUO;KOJIMA TAMAO
分类号 H05K1/03;H05K3/40;H05K3/46;(IPC1-7):H05K1/09;H05K1/14 主分类号 H05K1/03
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