| 摘要 |
<p>A process for enhancing the mounting surface of a hard surface comprises laser beam (21) cutting a void through the rotating mounting surface (11) and into the material (10), creating an undercut (40) for enhanced mechanical bonding properties. By repositioning the relative positions of the laser beam (21) and rotating suface (11), a plurality of different undercut voids (40) can be formed. Preferably the laser beam (21) can be pulsed and synchronized with the speed of rotation of the surface for cutting a pattern of undercut voids in the surface. Apparatus comprises a rotating plate (14) to which the material is temporarily affixed, a drive (23) for rotating the affixed mounting surface in its plane and a laser (20) which emits a laser beam (21) along an axis which intercepts the mounting surface and which is angled from the plate's axis (r) of rotation. A controller (25) and a two dimensional actuator control (31x31z) the relative coordinates of the intercept ofthe laser beam and mounting surface.</p> |
