| 摘要 |
The present invention relates to a cover element, such as a lid for a module, such as a DC/DC-module and then preferably for a DC/DC-module of the so-called BGA-type. To enable manufacture and handling of DC/DC-modules to be simplified, the modules have been provided with a lid (2). The main purposes of a module lid is to provide a surface which enables the module to be vacuum-plucked and which provides a surface for marking the module and also which provides a certain degree of mechanical protection to the module printed circuit board (1) when handling the module. The lid has partially open sides (5) which enable cool air to pass around the components on the module and which also enable washing and rinsing liquids to be evacuated from the module. |
