RESIN COMPOSITION, MOLDED PRODUCTS FORMED THEREFROM AND USE THEREOF

摘要

A resin composition comprising 100 parts by weight of a synthetic resin and 50 to 1,500 parts by weight of magnesium oxide particles, characterized in that the magnesium oxide particles satisfy the following requirements (i) to (v): (i) the average secondary-particle diameter is 0.1 to 130 .mu.m, (ii) the specific surface area as measured by the BET method is 0.1 to 5 m2/g, (iii) the total content of iron compounds and manganese compounds is 0.01 wt.% or lower in terms of the metals, (iv) the sodium content is 0.001 wt.% or lower , and (v) the chlorine content is 0.005 wt.% or lower; and a molded article formed from the resin composition. The resin composition is excellent in fla me retardancy, heat conduction, and water resistance and is hence advantageousl y usable as an encapsulation material for heating electronic members such as semiconductors.