| 摘要 |
A process is claimed for producing an electroplated metal layer of external contacts on one side of chip module tapes, which have an initial standard layer structure of epoxide/soft gold/nickel/copper/nickel/soft gold provided, on one side, with chips (5) and a chip covering material (6). A number of chip modules, which are arranged opposite one another on the epoxide tape (7) and which are still joined together by electrical conductors, are contacted at the electrical conductors by the electroplating clamping elements at both sides of the tape (7) so that the chip module underside (13) is electroplated with metal (9) while the plastic upper side (14) remains free of metal. |
