发明名称 |
Production of an insulating collar in a trench capacitor comprises forming a trench in the substrate, forming an insulating layer in the trench, filling with filler material |
摘要 |
Production of an insulating collar in a trench capacitor comprises: (a) preparing a semiconductor substrate (5), forming a trench (10) in the substrate; (b) forming an insulating layer (35) in the trench to form an insulating collar (75); (c) filling a lower region (50) of the trench with a sacrificial filler material (40) so that an upper region (45) of the trench remains free from the filler material; (d) forming a structured layer on the insulating layer and on the filler material; (e) forming an opening (60) in the structured layer, removing the filler material; and (f) removing the insulating layer from the lower region by etching the insulating layer selectively to the structured layer. Preferred Features: The structured layer and the filler material are made of silicon nitride, polysilicon, amorphous silicon or photolacquer.
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申请公布号 |
DE19956078(A1) |
申请公布日期 |
2001.05.31 |
申请号 |
DE19991056078 |
申请日期 |
1999.11.22 |
申请人 |
INFINEON TECHNOLOGIES AG |
发明人 |
SCHREML, MARTIN;KRASEMANN, ANKE;KOEHLER, DANIEL;HAUPT, MORITZ;HENNECKE, SABINE |
分类号 |
H01L21/334;H01L21/8242;(IPC1-7):H01L21/824 |
主分类号 |
H01L21/334 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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