Flux medium-free solder device with reactive gas enriched metal melting for electronic components, has solder container for molten solder material, and gas delivery device for introducing reducing reactive gas

摘要

The device has a solder container (2) for accommodating a molten solder material and a gas delivery device for introducing a reducing reactive gas into the soldering material. The gas delivery device has a gas electrode (3) accommodated in the solder container about which the solder flows, at least near a gas outlet opening (5), during correct operation. Independent claims are also included for the following: a method of soldering workpieces.