发明名称 METHOD AND APPARATUS FOR SEPARATING NON-METALLIC MATERIALS
摘要 <p>A method and apparatus for splitting non-metallic substrates includes a laser for generating a laser beam. An integrated cracking device receives the laser beam and directs the laser beam onto a non-metallic substrate to define the heat affected zone and quench the substrate at a quenching region contained within the heat affected zone. This integrated cracking device includes a housing and optics fitted within the housing for receiving and directing the laser beam onto the substrate. A quenching nozzle is mounted on the housing for quenching the substrate at a quenching region defined within the heat affected zone.</p>
申请公布号 WO0138039(A1) 申请公布日期 2001.05.31
申请号 WO2000US32076 申请日期 2000.11.22
申请人 APPLIED PHOTONICS, INC. 发明人 HOEKSTRA, BRIAN;FLANNIGAN, ROGER;WEGERIF, DAVID
分类号 B28D5/00;B23K26/00;B23K26/06;B23K26/14;B23K26/40;C03B33/033;C03B33/09;C03B33/10;(IPC1-7):B23K26/40 主分类号 B28D5/00
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