发明名称 |
Electroconductive composition and printed circuit board using the same |
摘要 |
Provided is an electroconductive paste comprising copper powders, a glass powder, and an organic vehicle, wherein: the copper powders comprise (1) from about 50% to 90% by weight of a copper powder A containing from about 1% to 3% by weight of oxygen and having an average particle size of from about 0.9 to 1.5 mum; and (2) from about 10% to 50% by weight of a copper powder B containing from about 0.2% to 3% by weight of oxygen and having an average particle size of not more than about 0.6 mum. It has an excellent electroconductivity as well as a sufficiently large bonding strength to a board. |
申请公布号 |
GB0109258(D0) |
申请公布日期 |
2001.05.30 |
申请号 |
GB20010009258 |
申请日期 |
2001.04.12 |
申请人 |
MURATA MANUFACTURING CO. LTD. |
发明人 |
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分类号 |
B01J13/00;C03C8/18;C08K3/08;C08K3/24;C08K3/40;C08K5/00;C08K5/098;C08L83/00;C08L101/00;C09D5/24;C09D7/12;C09D201/00;H01B1/16;H01L23/498;H05K1/09 |
主分类号 |
B01J13/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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