发明名称 Electroconductive composition and printed circuit board using the same
摘要 Provided is an electroconductive paste comprising copper powders, a glass powder, and an organic vehicle, wherein: the copper powders comprise (1) from about 50% to 90% by weight of a copper powder A containing from about 1% to 3% by weight of oxygen and having an average particle size of from about 0.9 to 1.5 mum; and (2) from about 10% to 50% by weight of a copper powder B containing from about 0.2% to 3% by weight of oxygen and having an average particle size of not more than about 0.6 mum. It has an excellent electroconductivity as well as a sufficiently large bonding strength to a board.
申请公布号 GB0109258(D0) 申请公布日期 2001.05.30
申请号 GB20010009258 申请日期 2001.04.12
申请人 MURATA MANUFACTURING CO. LTD. 发明人
分类号 B01J13/00;C03C8/18;C08K3/08;C08K3/24;C08K3/40;C08K5/00;C08K5/098;C08L83/00;C08L101/00;C09D5/24;C09D7/12;C09D201/00;H01B1/16;H01L23/498;H05K1/09 主分类号 B01J13/00
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