发明名称 |
PRODUCTION METHOD FOR FLEXIBLE SUBSTRATE |
摘要 |
A process for manufacturing a flexible wiring board according to the present invention comprises growing metal bumps 16 using a mask film patterned by photolithography. Fine openings can be formed with good precision, therefore, fine metal bumps 16 can be formed with good precision because laser beam is not used to form openings in a polyimide film. After metal bumps 16 have been formed, the mask film is removed and a liquid resin material is applied and dried to form a coating, which is then cured into a resin film. The coating can be etched at surface portions during coating stage to expose the tops of metal bumps 16. <IMAGE> |
申请公布号 |
EP1104226(A1) |
申请公布日期 |
2001.05.30 |
申请号 |
EP19990933149 |
申请日期 |
1999.07.29 |
申请人 |
SONY CHEMICALS CORPORATION |
发明人 |
HISHINUMA, HIROYUKI;KURITA, HIDEYUKI;ITO, RYO;NAKAMURA, MASAYUKI |
分类号 |
H05K3/18;H01L21/48;H01L21/60;H01L23/498;H05K3/40;H05K3/42;H05K3/46 |
主分类号 |
H05K3/18 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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