| 摘要 |
A micromachine package (800) includes a micromachine chip (412) having a micromachine area (414) in an upper surface of micromachine chip (412). A coupon (452) is attached above micromachine area (414) by a bead (450). Coupon (452) and bead (450) form an enclosure, which defines a free space (454) above micromachine area (414). This enclosure has sufficient structural integrity to withstand the injection of plastic encapsulant (814) around micromachine chip (412), bead (450), and coupon (452). Further, by forming coupon (452) of ceramic, coupon (452) does not accumulate static charge which would render micromachine chip (412) inoperable, and coupon (452) does not have to be grounded. |
