| 摘要 |
PROBLEM TO BE SOLVED: To prevent a brazing material for brazing a metal circuit board on a ceramic board from melting and spreading, and an electrical short circuit from being generated between adjacent metal circuit boards. SOLUTION: A brazing material paste, containing active metal brazing material and aggregate 2a, is formed. The metal brazing material is composed of brazing material powder composed of silver powder and copper powder and/or silver-copper alloy and at least one kind among titanium, zirconium, hafnium and hydride of them. The aggregate 2a is formed by jointing high melting point metal powder whose melting point is 1,200 deg.C or higher having point junction. A metal circuit board 3 is brazed on a ceramic substrate 1, by using the active metal brazing material.
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