发明名称 Method of producing a wafer with an epitaxial quality layer and device with epitaxial quality layer
摘要 A method of making a wafer is provided. A first semiconductor film is formed onto a semiconductor substrate. An epitaxial film is formed onto an epitaxial wafer. The epitaxial wafer is placed with the epitaxial film on the first semiconductor film. The epitaxial film is debonded from the EPI wafer. The epitaxial film is bonded to the first semiconductor film.
申请公布号 US6238482(B1) 申请公布日期 2001.05.29
申请号 US19990258738 申请日期 1999.02.26
申请人 INTEL CORPORATION 发明人 DOYLE BRIAN S.;RAVI KRAMADHATI V.
分类号 C30B25/18;C30B33/00;H01L21/762;(IPC1-7):C30B25/18 主分类号 C30B25/18
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