发明名称 |
Method for mounting a semiconductor chip on a substrate, and semiconductor device adapted for mounting on a substrate |
摘要 |
A semiconductor device is adapted for mounting on a substrate that has a chip-mounting region provided with a plurality of solder points. The semiconductor device includes a semiconductor chip having a pad-mounting surface provided with a plurality of bonding pads which are disposed on the pad-mounting surface at locations that are offset from locations of corresponding ones of the solder points on the chip-mounting region. Conductive bodies are formed on the pad-mounting surface to establish the required electrical connection among the bonding pads and the corresponding ones of the solder points.
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申请公布号 |
US6239488(B1) |
申请公布日期 |
2001.05.29 |
申请号 |
US20000520719 |
申请日期 |
2000.03.08 |
申请人 |
CHEN I-MING |
发明人 |
CHEN I-MING |
分类号 |
H01L23/12;H01L21/60;H01L23/485;H01L23/532;H05K3/12;(IPC1-7):H01L23/48 |
主分类号 |
H01L23/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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