| 摘要 |
A method of forming a semiconductor device includes forming a moat stack outwardly from a substrate, the moat stack comprising a dielectric pad disposed outwardly from the substrate, a silicon buffer structure disposed outwardly from the dielectric pad, and a protective dielectric cap disposed outwardly from the silicon buffer structure. The method further comprises forming a protective sidewall structure outwardly from at least a sidewall of the silicon buffer structure, forming an isolation dielectric region adjacent to the moat stack, after formation of the isolation dielectric region, removing the protective dielectric cap, and forming a conductive gate comprising the silicon buffer structure.
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