| 摘要 |
PROBLEM TO BE SOLVED: To provide a lead-forming device which is capable of coping with warpage of a semiconductor and applicable to a thin package. SOLUTION: Projections 5 and clampers 6 are each provided with a spherical tip, slopes provided to the sides of the outer casing of a semiconductor device 1 are point-pressed by the spherical tips, by which a clamping force can be disperse, and a semiconductor device can be held in conformity with its shape. Therefore, the influence of spring back after the formation of leads is relaxed. A semiconductor device can be held in a state, in which a silicon chip is not located just under a clamping means, so that the silicon chip is damaged less.
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