发明名称 BOARD MOUNTING HOUSING AND BOARD MOUNTING METHOD
摘要 PROBLEM TO BE SOLVED: To prevent the price of a mother board from increasing without lowering the cooling efficiency of a daughter board. SOLUTION: A cooling air inlet 6 is provided on the front side and when a daughter board 4 is inserted horizontally from the front side of a housing 5 having an air outlet 7 on the back face side, the horizontal mount connector 1 of the daughter board 4 is fitted in the horizontal mount connector 2 of a mother board 3. Consequently, the wiring containing rate in the mother board 3 is prevented from lowering and cooling air can be fed uniformly to the daughter board 4 by passing the cooling air from the cooling air inlet 6 along the daughter board 4 and discharging it from the air outlet 7.
申请公布号 JP2001148587(A) 申请公布日期 2001.05.29
申请号 JP19990328344 申请日期 1999.11.18
申请人 NEC KOFU LTD 发明人 NAKAMURA YASUHITO
分类号 H05K7/20;H05K7/14;(IPC1-7):H05K7/20 主分类号 H05K7/20
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