APPARATUS FOR ELIMINATING SOLDER OF PRINTED BOARD

摘要

PROBLEM TO BE SOLVED: To provide an apparatus for eliminating solder of a printed board, where micronized solder will not scatter from a port by solving the problem where micronized solder scatters from a port of an apparatus, injuring a person and deteriorates the environment around the apparatus, in the conventional apparatus which eliminates solder by rubbing a soldered surface of a waste printed board with a rotating brush. SOLUTION: In the rotating direction of a roll type rotating brush, a screen is disposed upright in a solder recovering vessel adjacent to the brush. Micronized solder scattered by the brush is received by the screen and prevented from flying out to wards the outside.