发明名称 Process apparatus and method for improving plasma distribution and performance in an inductively coupled plasma
摘要 A processing system for processing a substrate with a plasma comprises a processing chamber defining a processing space and including a substrate support therein for supporting a substrate in the processing space and a gas inlet for introducing a process gas into said processing space. A plasma source is operable for creating a plasma in the processing space from process gas introduced therein. The plasma source comprises a dielectric window which interfaces with the processing chamber proximate the processing space and an inductive element positioned outside of the chamber and proximate the dielectric window. The inductive element is operable for coupling electrical energy through the dielectric window and into the processing space to create a plasma therein and comprises a variety of alternative designs for providing a dense, uniform plasma.
申请公布号 US6237526(B1) 申请公布日期 2001.05.29
申请号 US19990277526 申请日期 1999.03.26
申请人 TOKYO ELECTRON LIMITED 发明人 BRCKA JOZEF
分类号 H05H1/46;B01J19/08;C23C14/34;C23C16/507;H01J37/32;H01L21/205;H01L21/302;H01L21/3065;(IPC1-7):C23C16/00;H01J7/24 主分类号 H05H1/46
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