| 摘要 |
PROBLEM TO BE SOLVED: To provide a tape sticking method to a semiconductor substrate and a device therefor capable of preventing tape sticking failure/redoing of work by uniformly pressing down a protective tape, capable of setting pressing-down pressure to a base board surface constant, capable of restraining balance adjusting labor and capable of preventing pressure concentration and influence on a pattern by sticking the tape under uniform pressing-down pressure. SOLUTION: In a tape sticking technique for sticking a tape by pressing down the tape to a semiconductor substrate by a tape sticking roller, (1) the roller 1 is supported at both ends, and pressing down force (a pneumatic cylinder) 3 of a pressing-down force applying means to the roller is transmitted to the roller via a universal joint 2. (2) The semiconductor substrate is partitioned into plural areas, and is controlled so as to become proper pressing- down bearing in respective divisions.
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