ELECTRONIC DEVICE, ITS MANUFACTURING METHOD, AND ITS MANUFACTURING EQUIPMENT

摘要

PROBLEM TO BE SOLVED: To offer an electronic device such as a semiconductor device, its manufacturing method, and its manufacturing equipment, which can avoid cracks and fractures in a ceramic substrate, by eliminating distorting power through buffering the pressure even when the ceramic substrate is sandwiched between top and bottom molds and is pressed. SOLUTION: A ceramic substrate 32, at least one side (selected from front side and rear side) of which is integrated with a thin metallic film 2, is positioned inside and outside a cavity 38 of transfer molds so that the thin metallic film 2 is at positions where the top mold 30 and bottom mold 31 come into contact with each other.