| 摘要 |
PROBLEM TO BE SOLVED: To provide a metal lid for preventing the wetting spread of a soldering material, and a package with the metal lid. SOLUTION: A metal lid 1 is provided with a package body 11 and a frame- shaped sealing surface 1F that is joined by soldering. Also, a projecting part 5 is provided, where it is positioned near an inner-periphery end 1FN of the sealing surface 1F out of the inside in the direction of the diameter of the sealing surface 1F and projects over the sealing surface 1F. The surface roughness of an outer-periphery end 5AG of a top part 5A of the projecting part 5 is set to Ra=0.3μm or more. Also, distance from an outer-periphery end 1G of the metal lid 1 for forming an outer-periphery end 1FG of the sealing surface 1F to the projecting part 5 is constant over an entire periphery.
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