SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor device and a manufacturing method capable of improving the adhesion on an interlayer dielectric of the wiring of a narrow wiring width, preventing the falling and peeling of the wiring and performing manufacture at a low cost. SOLUTION: The irregularities of prescribed height are formed on the surface of the interlayer dielectric on a semiconductor substrate where a semiconductor element is formed and the wiring is formed on the irregularities.