Electrical assembly that includes a heat sink which is attached to a substrate by a clip

摘要

An electronic assembly which includes a heat sink that is pressed into an integrated circuit package by a clip. The integrated circuit package is mounted to a substrate. The clip has an L-shaped ear that is inserted through a clearance hole of the substrate and an attachment hole of the heat sink to attach the heat sink to the substrate. The clip also presses the heat sink into the package. Attaching the heat sink directly to the package reduces the flatness requirements of the sink and the cost of producing the assembly.