| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a housing case capable of surely and easily performing transportation without damaging the surface of a disk and improving the efficiency of investment in plant and machinery. SOLUTION: This housing case 10 for housing the disk (semiconductor wafer W) is provided with a disk housing space 4 and a holding part 5 for holding the peripheral edge of the disk D. The disk is surely held by the holding part 5 and the disk is housed in the housing case 10 functioning as a cover for covering the disk and carried. Also, by joining the two housing cases 10 by connections 6 and combining them, a sheet type disk case for completely covering the disk is constituted. Further, by binding the sheet type disk cases piled up in plural stages by a holder, the case is used as the housing case capable of housing a plurality of disks as well.</p> |
