发明名称 Titanium nitride barrier layers
摘要 Improved titanium nitride barrier layers are formed by depositing a first titanium layer; treating this layer with an oxygen plasma to form an oxygen-containing titanium layer thereover; depositing a titanium nitride layer over the oxygen-containing titanium layer; and treating the titanium nitride layer with an oxygen-containing plasma. Robust titanium nitride barrier layers are formed that can prevent spiking by an overlying aluminum contact layer even after heat treatment up to 550° C.
申请公布号 US6238803(B1) 申请公布日期 2001.05.29
申请号 US20000501566 申请日期 2000.02.09
申请人 APPLIED MATERIALS, INC. 发明人 FU JIANMING;XU ZHENG;CHEN FUSEN
分类号 C23C14/06;H01L21/285;H01L21/768;(IPC1-7):C23C14/06 主分类号 C23C14/06
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