发明名称 Method of forming isolation structure for isolating high voltage devices
摘要 A method of forming an isolation structure for isolating high voltage devices is described. A first p-well is formed in and on a substrate. Two field oxides are formed spaced apart from each other over the first p-well. A second p-well is formed in and on the first p-well, wherein the second p-well substantially surrounds and substantially being adjacent to the field oxides in the first p-well. A trench isolation is formed in and on the first p-well and between the field oxides, wherein the trench isolation is substantially deeper than the second p-well. A third p-well substantially surrounding and being adjacent to the trench isolation is formed in the first p-well.
申请公布号 US6239000(B1) 申请公布日期 2001.05.29
申请号 US20000495248 申请日期 2000.01.31
申请人 UNITED MICROELECTRONICS CORP. 发明人 TUNG MING-TSUNG
分类号 H01L21/762;(IPC1-7):H01L21/76 主分类号 H01L21/762
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