| 摘要 |
A method of processing a substrate for removing a coating film from a substrate by dissolving the coating film with a solvent, comprising the steps of (a) supplying a solvent independently to each of peripheral portions of an upper surface side and a lower surface side of the substrate, and (b) supplying the solvent to the peripheral portion of the lower surface side of the substrate in an amount lower than the solvent supplied to the peripheral portion of the lower surface side in the step (a) or lower than that supplied to the peripheral portion of the upper surface side in this step (b), or terminating a supply of the solvent.
|
