发明名称 High density connector module
摘要 The invention allows for an increase in termination density for customer cable pairs in electronic cabinets, building terminals, and protectors and switching equipment terminations in central offices by providing a connector module is provided having a first insulating housing cap including a row of slots and a row of contact cavities defined within the first housing cap by contact guiding walls. Each slot is adapted for receiving a wire and each cavity is arranged in open communication with one of the slots and has a first orientation relative to the slots. A second insulating housing cap including a row of slots and a row of contact cavities defined within the second housing cap by contact guiding walls. Each slot is adapted for receiving a wire and each cavity being arranged in open communication with one of the slots and has a second orientation relative to the slots. A row of contacts are mounted within the first and second housing caps. Each contact includes a first wire termination portion capable of providing electrical connection to a first wire and being mounted within the first housing cap so as to be positioned within the first housing cap slot, and a second wire termination portion capable of providing electrical connection to a second wire and being mounted within the second housing cap so as to be positioned within the second housing cap slot.
申请公布号 US6238232(B1) 申请公布日期 2001.05.29
申请号 US19990387456 申请日期 1999.09.01
申请人 AVAYA TECHNOLOGY CORP. 发明人 BRIGGS, JR. PAUL RAYMOND;CURTIS MARK STEVEN;MAY JOHN FRANCIS;NOON ROBERT KEVIN;ZOUCHA CLARION FLOYD
分类号 H01R4/24;H01R9/24;H04Q1/14;(IPC1-7):H01R4/24;H01R4/26;H01R11/20 主分类号 H01R4/24
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