| 摘要 |
PROBLEM TO BE SOLVED: To provide a compact light-emitting device that will not be damaged easily from external stresses. SOLUTION: This light-emitting device is equipped with an insulating substrate where a through-hole is provide, a pair of electrodes that is provided on the back surface of the insulating substrate, while each end part is mutually separated in the through-hole on the insulating substrate, an LED chip that is erected between the electrodes in the through-hole of the insulating substrate for arranging while p- and n-side semiconductor layers are subjected to p-n junction and the p-n junction surface becomes vertical to the insulating substrate, conductive paste that bonds the p- and n-side semiconductor layers of the LED chip to each of the electrodes on the insulating substrate in a conductive state, and light transmitting resin, that seals the LED chip and each conductive paste. |
