发明名称 EMI containment for microprocessor core mounted on a card using surface mounted clips
摘要 An electronic cartridge which includes a cover that is electrically coupled to a substrate by a clip. An integrated circuit package is mounted to the substrate and at least partially enclosed by the cover. The clips and cover may be connected to a ground plane of the substrate. The cover and substrate may create a "shield" about the integrated circuit package so that any electromagnetic field that flows from the package is grounded to the substrate.
申请公布号 US6239973(B1) 申请公布日期 2001.05.29
申请号 US20000535424 申请日期 2000.03.27
申请人 INTEL CORPORATION 发明人 TAYLOR SCOT W.;STARKSTON ROBERT;GEALER CHARLES;RUTIGLIANO MICHAEL L.;KRICK RAYMOND A.;RABENIUS JOHN A.;HART EDMOND L.;MAHAJAN RAVI V.;FARES FARUKH
分类号 H05K9/00;(IPC1-7):H05H7/20 主分类号 H05K9/00
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