发明名称 |
EMI containment for microprocessor core mounted on a card using surface mounted clips |
摘要 |
An electronic cartridge which includes a cover that is electrically coupled to a substrate by a clip. An integrated circuit package is mounted to the substrate and at least partially enclosed by the cover. The clips and cover may be connected to a ground plane of the substrate. The cover and substrate may create a "shield" about the integrated circuit package so that any electromagnetic field that flows from the package is grounded to the substrate.
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申请公布号 |
US6239973(B1) |
申请公布日期 |
2001.05.29 |
申请号 |
US20000535424 |
申请日期 |
2000.03.27 |
申请人 |
INTEL CORPORATION |
发明人 |
TAYLOR SCOT W.;STARKSTON ROBERT;GEALER CHARLES;RUTIGLIANO MICHAEL L.;KRICK RAYMOND A.;RABENIUS JOHN A.;HART EDMOND L.;MAHAJAN RAVI V.;FARES FARUKH |
分类号 |
H05K9/00;(IPC1-7):H05H7/20 |
主分类号 |
H05K9/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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