| 摘要 |
PROBLEM TO BE SOLVED: To obtain a resin composition for sealing a semiconductor excellent in balance among high fluidity, low expansibility, high fracture toughness, high flexural strength, low solder reflow properties and low abrasion resistance of a metal mold. SOLUTION: This nonspherical molten siliceous powder is characterized by having >=50% content of particles having angles with <=0.25 degree of roundness in least one or more sites and <5% content of particles having angles with <0.01 degree of roundness, >=95% melting ratio and 0.75-0.90 average degree of sphericity. The resin composition is characterized in that the nonspherical molten siliceous powder or a siliceous powder containing the same is filled therein.
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