发明名称 Method for microplasma electrolytic processing of surfaces of electroconductive materials
摘要 A method for microplasma electrolytic processing a surface of an electroconductive material, involves establishing an electrical circuit between this material, as a first electrode, and a counterelectrode, as a second electrode, by immersing the first electrode into an electrolyte that is in contact with the second electrode and applying an electrical voltage across the first and second electrodes with a power source. In a first step, only a portion of the surface of the material is immersed in the electrolyte, the size of that portion being dependent on an output power of the power source, a composition of the material, an electric regime used, a composition of the electrolyte, and a minimal current density at which a process of microplasma oxidation is stable. The surface of the material is then completely immersed in the electrolyte while the voltage is regulated to cause a current value I(t) between the first and second electrodes ranging from 0.9I<I(t)1.1I; and then, in a subsequent stage, an electric regime is carried out in which the applied voltage ranges greatly with various changing forms and values of current.
申请公布号 US6238540(B1) 申请公布日期 2001.05.29
申请号 US19990350167 申请日期 1999.07.09
申请人 R-AMTECH INTERNATIONAL, INC. 发明人 TIMOSHENKO ALEKSANDR VLADIMIROVICH;RAKOCH ALEKSANDR GRIGOREVICH
分类号 C25D11/02;C25D5/18;C25D9/00;(IPC1-7):C25D5/00 主分类号 C25D11/02
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