| 摘要 |
The invention relates to the coupling of electric signals to and from high- speed electronic components, being particularly suited to couple high-frequency signals or very host pulses to diode lasers, and from high-speed photodiodes. The coupler consists of a device formed by joining at least two diverse planar transmission-line structures, the central signal-carrying conductor (22, 31) being shared among all the structures so joined, while the ground planes (26, 27, 29; 32, 33; 34, 36) maintain the positional relationship to said conductor that characterize each of the structures so joined. The characteristic impedance change, from 50-ohm usual line impedance to 5-ohm diode impedance is achieved gradually along the device through the cumulative effect of the individual impedance changes of each transmission-line structure forming said coupler, which result from the gradual change of the dimensions of the cross-section along said coupler.
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