| 摘要 |
PROBLEM TO BE SOLVED: To stabilize high-accuracy bump bonding. SOLUTION: On a tail 4a of a wire 4 projecting toward the end of a capillary 12a, a metallic ball 4a is formed by electric discharge. Then the metallic ball 4a is pressed against an object 14 by the capillary 12a, and is friction-bonded to the object. When removing trailing wire 4 from the friction-bonded metallic ball to form a bump 22 by pulling back the capillary 12a and a clamper 8, the capillary 12a and the clamper 8 are moved at an appropriate speed so that the tail length of the wire 4 falls within the specified range even when being removed. |
