发明名称 RESIN-SEALED SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a pressure means, which is capable of pressing a work with high pressure by depressurizing only a pressure jig, where the work is put in the pressure jig, and the pressure jig is depressurized to press the work. SOLUTION: A work 1 is introduced into a pressure jig 2, which can be partially or fully deformed and is provided with an opening through which the pressure jig can be exhausted or air can be fed into the pressure jig, and the pressure jig 2 is depressurized to press the work. Furthermore, the pressure jig 2 is pressurized by a means, which presses fluid outside the pressure jig 2 and/or another means which fills the outside of the pressure jig with fluid. For instance, fluid between the pressure jig 2 and a pressure jig 3 is pressed, or a gap between the pressure jig 2 and pressure jig 3 is filled with fluid.
申请公布号 JP2001148447(A) 申请公布日期 2001.05.29
申请号 JP19990331347 申请日期 1999.11.22
申请人 NEC CORP 发明人 MOROI SADAYUKI;TABUCHI KOJI
分类号 H01L23/12;B29C33/12;B29C45/14;H01L21/56;H01L23/28;H01L23/50;(IPC1-7):H01L23/28 主分类号 H01L23/12
代理机构 代理人
主权项
地址