摘要 |
A laser beam machining apparatus has machining apparatus including a laser oscillator, a stage for moving a workpiece in XY directions, and a central processing unit (CPU) for controlling laser emission of the laser oscillator and movement of the stage. The CPU causes the laser beam machining apparatus to group machining points on the workpiece into a plurality of segments, each segment being a set of machining points aligned parallel to one of the X axis and Y axis, to create a shortest route through the plurality of segments, to drive the stage along the shortest route, and to apply a laser beam on the machining points on the shortest route.
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