| 摘要 |
PROBLEM TO BE SOLVED: To obtain a reactive hot-melt adhesive composition which has a low melting point, can be stuck at a relatively low temperature, and is excellent in heat resistance after cured. SOLUTION: This adhesive composition contains a cationically polymerizable compound having on average at least one cationically polymerizable group having a structure represented by formula (1) (m) and (n) are each 0, 1, or 2; and R1, R2, R3, and R4 are each H, methyl, ethyl, isopropyl, isoamyl, or phenyl) per molecule and a cationic polymerization initiator comprising an aromatic sulfonium salt having phosphorus hexafluoride as the counter anion.
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