发明名称 HIGH FREQUENCY CIRCUIT DEVICE
摘要 PROBLEM TO BE SOLVED: To connect a high frequency circuit installed in a substrate where a micro strip line cannot structurally be formed to the high frequency circuit of the other substrate by making the circuits impedance-matched. SOLUTION: A high frequency filter is formed in a slave substrate 1 formed out of a high dielectric material. It is converted into a coplanar line constituted of patterns 3 and 4 and ground patterns 5 and 6. The coplanar line is connected to the coplanar line of a main substrate 2 constituted of a pattern 7 and a ground pattern 8 by soldering. A signal on the coplanar line of the main substrate is converted into the microstrip line constituted of the pattern 7 and a ground pattern 9 at the back of the substrate. Thus, impedance is matched and the two high frequency circuits can be connected with low loss.
申请公布号 JP2001148601(A) 申请公布日期 2001.05.29
申请号 JP19990328974 申请日期 1999.11.19
申请人 FUJITSU GENERAL LTD 发明人 SUZUKI KUNITOSHI
分类号 H05K1/14;H01P1/04;H01P3/02 主分类号 H05K1/14
代理机构 代理人
主权项
地址
您可能感兴趣的专利