发明名称
摘要 PURPOSE:To make it possible to manufacture easily a circuit board of a structure, wherein a low-resistance material, such as copper, is used for conductor parts. CONSTITUTION:In a method of manufacturing an aluminum nitride circuit board, which forms conductor parts using a metal having a melting point lower than a temperature for calcining the aluminum nitride circuit board as a wiring material, necessary wiring patterns and the conductor parts, such as vias, are formed on and in an aluminum nitride green sheet 10 formed using aluminum nitride powder using a paste consisting of one of copper, gold and silver and the sites of the conductor parts exposed on the outer surface of the sheet 10 are covered with an aluminum nitride paste 18. Moreover, by calcining the sheet 10 in a non-oxidizing atmosphere, a sintered body is formed and the outer surface of the sintered body is polished to make the conductor parts expose on the outer surface of the sintered body.
申请公布号 JP3171695(B2) 申请公布日期 2001.05.28
申请号 JP19920262928 申请日期 1992.09.05
申请人 发明人
分类号 C04B35/581;C04B35/58;H05K1/03;H05K3/46 主分类号 C04B35/581
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