| 摘要 |
A lead frame for a semiconductor device, comprising; a die pad having a major surface upon which a semiconductor die is placed, the major surface being clad with a metal layer, an inner lead portion electrically connected to the semiconductor die, wherein the die pad and the inner lead portion are embedded within a molding resin, and an outer lead portion exposed outside the molding resin, electrically connected to the inner lead portion, and adapted for connection to a printed circuit board land, wherein the die pad, inner lead portion, and outer lead portion are formed from a metal having a thermal expansion coefficient equal to that of the printed wiring board land. |
