| 摘要 |
The equipment for soldering flat objects, such as printing plates (18), comprises a container for holding solder (6), in which a soldering tower (1) is positioned. A pump delivers solder to the tower, which then flows over the tower edges and transport devices (11) bring an object to be soldered over the soldering tower. Gas feed equipment feeds gas with a low oxygen content to the vicinity of the soldering tower. The gas feed equipment, viewed in the direction of movement of the transport dvices, is fitted on the lateral sides of the soldering tower, and comprises at least one pipe (14) of porous material extending in the transport direction.
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