PHOTOSENSITIVE COMPOSITION AND PRODUCTS OF CURING THEREOF

摘要

A photosensitive composition, characterized by comprising a prepolymer (A) bearing at least two polymerizable unsaturated groups and at least one carboxyl group in one molecule, a photopolymerization initiator (B), a reactive diluent (C), and a blocked isocyanate (D). It is preferable that the components (B), (C) and (D) are contained in amounts of 1 to 30, 1 to 100, and 2 to 100 parts by weight respectively per 100 parts by weight of the component (A). The composition can give, via irradiation with actinic radiation, cured films which are excellent not only in developability, curing properties, stability, and resistance of exposed areas to developer, but in properties necessary to solder resists, e.g., close adhesion, insulation properties, resistance to soldering heat, resistances to solvent, acid and alkali, and plating resistance.