| 摘要 |
PROBLEM TO BE SOLVED: To provide an apparatus and a method for coating a bonding paste superior in operability and satisfactory in coating quality. SOLUTION: In the method for coating bonding paste, a prescribed amount of the paste is coated at the chip-mounting position of a substrate. The specified amount for the chip bonding is obtained at a coating calculating unit 56. The calculated amount is converted to a virtual coating distance defined as the longest distance movable of a coating nozzle until the amount has been ejected. The coating pattern is set on the basis of the virtual coating distance, and the bonding paste is coated with the coating nozzle travelled in accordance with the coating pattern. Thus, the coating pattern can be adequately determined, in response to the objective chip with proper operability.
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