| 摘要 |
PROBLEM TO BE SOLVED: To provide a socket which is obtainable of high connecting reliability of a terminal group of a package with electrodes on a board and compatible with trend of thinner, smaller and higher-density of a semiconductor package. SOLUTION: In a socket 1 for mounting a land grid array type of package 4 to a board 6, the socket comprises a flexible wiring board 30 including the first group of electrodes 31 being connected with a array type of terminal electrodes of the package 4 and the second group of electrodes 32 being connected with electrode group on the board, a socket body 2 for mounting the flexible wiring board 30, and a cover 3 for pressing and attaching the package 4 toward the socket body 2. A plurality of uplifting pieces 33 is provided at the flexible wiring board 30 to protrude toward one side thereof. The first group of electrodes 31 is provided at a surface of each of uplifting pieces 33, respectively. The second group of electrodes 32 is provided at the other surface of the flexible wiring board 30.
|
